JPH0143039B2 - - Google Patents
Info
- Publication number
- JPH0143039B2 JPH0143039B2 JP1751381A JP1751381A JPH0143039B2 JP H0143039 B2 JPH0143039 B2 JP H0143039B2 JP 1751381 A JP1751381 A JP 1751381A JP 1751381 A JP1751381 A JP 1751381A JP H0143039 B2 JPH0143039 B2 JP H0143039B2
- Authority
- JP
- Japan
- Prior art keywords
- cathode
- circuit board
- printed circuit
- plating
- hole printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000007747 plating Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 13
- 238000009713 electroplating Methods 0.000 claims description 11
- 230000033001 locomotion Effects 0.000 claims description 9
- 230000000737 periodic effect Effects 0.000 claims description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 11
- 229910052759 nickel Inorganic materials 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 3
- 239000004327 boric acid Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910021586 Nickel(II) chloride Inorganic materials 0.000 description 1
- 229910000978 Pb alloy Inorganic materials 0.000 description 1
- 239000001888 Peptone Substances 0.000 description 1
- 108010080698 Peptones Proteins 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QMMRZOWCJAIUJA-UHFFFAOYSA-L nickel dichloride Chemical compound Cl[Ni]Cl QMMRZOWCJAIUJA-UHFFFAOYSA-L 0.000 description 1
- 235000019319 peptone Nutrition 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- FDDDEECHVMSUSB-UHFFFAOYSA-N sulfanilamide Chemical compound NC1=CC=C(S(N)(=O)=O)C=C1 FDDDEECHVMSUSB-UHFFFAOYSA-N 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1751381A JPS57210989A (en) | 1981-02-10 | 1981-02-10 | Electroplating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1751381A JPS57210989A (en) | 1981-02-10 | 1981-02-10 | Electroplating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57210989A JPS57210989A (en) | 1982-12-24 |
| JPH0143039B2 true JPH0143039B2 (en]) | 1989-09-18 |
Family
ID=11946043
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1751381A Granted JPS57210989A (en) | 1981-02-10 | 1981-02-10 | Electroplating method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57210989A (en]) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60251296A (ja) * | 1984-05-28 | 1985-12-11 | Asahi Chem Ind Co Ltd | 微細パタ−ンメツキの方法 |
| JPH07112111B2 (ja) * | 1986-04-09 | 1995-11-29 | 旭化成工業株式会社 | フレキシブル基板用スル−ホ−ル回路形成方法 |
| DE102007026633B4 (de) * | 2007-06-06 | 2009-04-02 | Atotech Deutschland Gmbh | Vorrichtung und Verfahren zum elektrolytischen Behandeln von plattenförmiger Ware |
-
1981
- 1981-02-10 JP JP1751381A patent/JPS57210989A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57210989A (en) | 1982-12-24 |
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